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Raysea Technology Takes the Stage in SEMICON China 2019 International Forum

Time:2019-03-23

【Abstract】: SEMICON China, a grand semiconductor event, was held in Shanghai New International Expo Center on March 20, 2019. As an emerging force in the field of Group III-VI compound VCSEL, Raysea Technology participated in the Power&Component Semiconductor International Forum and made speeches with more than 20 enterprises at home and abroad. James Liu, CEO of Raysea Technology, introduced the technical characteristics of VCSEL in detail to nearly 500 professional audiences from all fields around the world Market application and development history. At the same time, the latest progress in performance iteration and mass production capacity of VCSEL chips such as Raysea Technology structured light, TOF, etc. was demonstrated on site.

SEMICON China 2019 was held in Shanghai New International Expo Center from March 20 to 22. The exhibition forum with the theme of “Crossing the World, Connecting the Heart and the Core” attracted more than 1000 enterprises, including mainstream equipment and material manufacturers in semiconductor raw materials, manufacturing, testing, application and other industrial links at home and abroad.

As an important part of SEMICON China 2019, Power&Compound Semiconductor International Forum 2019 was held in Kerry Hotel, Pudong, Shanghai. As an emerging force in the VCSEL field of Group III-VI compounds, Raysea Technology, together with more than 20 enterprises at home and abroad, such as Finisar, a traditional international manufacturer of VCSEL, Wenmao, a semiconductor extension giant with the largest market share, IQE, IDM giant Infineon, and Wolfspeed (CREE), the first in the SiC field, made speeches on the stage one after another, targeting new optoelectronic displays, face recognition, broadband semiconductor power electronics 5G communication and other topics shared the latest technology trends in related fields.

James Liu, CEO of Raysea Technology, introduced VCSEL’s technical characteristics, market application and development history in detail to nearly 500 professional audiences from all fields around the world, and also demonstrated the latest progress in performance iteration and mass production capacity of Raysea Technology’s VCSEL chips such as structured light and TOF.

James Liu, CEO of Raysea Technology delivered a keynote speech

As a key equipment of artificial intelligence, VCSEL is widely used in 3D sensors, IoT, cloud computing, and automotive fields, and the whole market will develop rapidly in the next decade; At the same time, due to the material characteristics of the device itself under the conditions of high carrier concentration, high mechanical stress and high photon density, higher requirements are put forward for the reliability of VCSEL. Relying on the design and development and supply chain management and control capabilities accumulated in the industry VCSEL field for more than 20 years, Raysea Technology team fully considered the photoelectric conversion efficiency, uniformity, high temperature performance and reliability of the chip at the design stage. At the same time, through the rapid iteration of its own products and long-term strategic cooperation with the foundry with the strongest GaAs 6-inch process capability in the industry, the product performance is currently at the top level of the industry, It has passed the small batch delivery verification stage and has the capacity of mass production.